杨栋华

 

个人简介

 

杨栋华,副教授,硕士生导师。2008.09-2012.01,获得北京科技大学材料学工学博士学位;2012.04-2014.07清华大学博士后研究;2014.09至今,重庆理工大学材料科学与工程学院教师。在国内外重要刊物如Acta MaterialiaJournal of Materials Science: Materials in ElectronicsJournal of Electronic Materials等刊物上发表学术论文20余篇,申请并授权发明专利10余项。        

研究领域

微电子封装材料及可靠性,材料表面和界面

承担的主要项目

[1] 3D封装微小焊点界面金属间化合物的生长取向与其性能关联规律研究,重庆市基础与前沿研究一般项目, 2016.7-2019.6, 5,主持.

[2]温度梯度诱导全CoSn3金属间化合物微互连焊点的生长行为及可靠性研究,重庆市教委科学技术研究项目, 2016.7-2019.6, 5,主持.

[3]材料的组织控制及其分析测试,横向项目, 2015.7-2016.12, 7,主持.      

[4]大长径比身管的加工模拟及性能研究,横向项目, 2014.12-2015.12, 5,主持.      

[5] BGA封装中Sn-Ag(-Cu)/Co焊点的界面反应及可靠性,中国博士后面上基金, 2013.09-2014.07, 5,主持.      

[6]微型热电器件封装用新型非晶薄膜的扩散阻挡机制研究,重庆市重点产业共性关键技术创新专项(一般), 2016.1-2017.12,主持.      

[7]高热流密度下低银SAC微焊点加速热疲劳研究,国家自然科学基金, 2018.1-2020.12, 60,参与.      

     [8]同步低温原位合成7075铝基复合材料半固态浆料及其流变成形机制研究,国家自然科学基金(青年基金), 2016.1-2018.12, 25,参与.      

     

代表性成果

[1] Lu N,Yang D, Li L. Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures[J].Acta Materialia, 2013, 61(12): 4581-4590.    

[2]Yang D, Cai J, Wang Q, et al. IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling[J].Journal of Materials Science: Materials in Electronics, 2015, 26(2): 962-969.    

[3]Yang D, Yang G, Li L. Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints[J].Microelectronics Reliability, 2015, 55(11): 2403-2411.    

[4] Li S,Yang D, Tan Q, et al. Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material[J].Journal of Electronic Materials, 2015, 44(6): 2007-2014.    

[5]Yang D, Yang G, Cai J, et al. Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization:2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015.    

[6]Yang D, Lu N, Li L. Wettability of Sn-Bi and Sn-Ag-Cu lead-free solder pastes on electroplated Co-P films:63rd Electronic Components and Technology Conference (ECTC), 2013.    

[7]Yang D, Yang G, Cai J, et al. Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling:2014 15th International Conference on Electronic Packaging Technology (ICEPT), 2014.